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2006 KOSDAQ »óÀå
2005 Laser Dicing Saw Àåºñ¾ÈÀü ÀÎÁõ ( Çѱ¹ »ê¾÷ ¾ÈÀü °ø´Ü )
2004 ISO9001/2000 ÀÎÁõ
    Laser Saw °³¹ß - »ï¼ºÀüÀÚ ³³Ç°
2002 º¥Ã³±â¾÷ ÀÎÁõ ( ½Å±â¼ú °³¹ß )
2001 ¿ì·®±â¼ú±â¾÷¼±Á¤ ( ±â¼ú½Å¿ëº¸Áõ±â±Ý ), ISO9001ÀÎÁõ
2000 ´ëÅë·Éǥâ ¼ö»ó
    º¥Ã³±â¾÷, °æ±âµµ Áß¼Ò±â¾÷, 100¸¸ºÒ¼öÃâž ¼ö»ó, »ç¿ÁÀÌÀü
1999 Wafer Level Solder Ball Attach °³¹ß - »ï¼ºÀüÀÚ ³³Ç°
1998 Wafer Level Laser Marking Handle °³¹ß - ¾Æ³²¹ÝµµÃ¼ ³³Ç°
1997 BGA Solder Ball Attach Machine °³¹ß
1996 In-Tray Laser Marking Handler °³¹ß
1995 Inspection System °³¹ß
1994 ¢ß °í·Á¹ÝµµÃ¼½Ã½ºÅÛ ¹ýÀÎÀüȯ 
1993 Laser Marking Handler °³¹ß
1992 Pad Marking Handler °³¹ß
1991 Mini Tabelt System °³¹ß
1990 °í·Á½Ã½ºÅÛ ¼³¸³

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  • ȨÆäÀÌÁö : http://www.koses.co.kr

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