ȸ»ç¼Ò°³
(ÁÖ)ÄÉÀÌ¿ø¼Ö·ç¼ÇÀº 1989³â â»ç ÀÌ·¡, ¹ÝµµÃ¼ ÁÖ¿ä ¼ÒÀç ±¹³» ÃÑÆÇ ´ë¸®Á¡À¸·Î¼ Wafer(Substrate), Photoresist, Àåºñ¸¦
±¹³» ´ëºÎºÐÀÇ ¿¬±¸¼Ò¿Í »ê¾÷ü µî¿¡ °ø±ÞÇϰí ÀÖÀ¸¸ç, 2011³â LED Á¶¸í »ç¾÷ºÎ¸¦ ½Å±Ô Ãâ¹üÇÏ¿©, ±¹³»/¿Ü Á¦Ç°ÀÇ ±¹³» °ü¼ö/¹Î¼ö/µµ¸Å À¯Åë ½ÃÀå¿¡ °ø±ÞÇϰí ÀÖ½À´Ï´Ù. ±×¸®°í ´Ù¾çÇÑ °í°´´ÏÁî¿¡ ´ëÀÀÇϱâ À§ÇØ ÆÐ·²¸° ÄÚÆÃ¼ºñ½º »ç¾÷À» ÁøÇàÁßÀ̸ç, ÇöÀç ÀüÀÚ Á¦Ç° µî IT °ü·Ã Á¦Ç°ÀÇ ºÎǰ »ç¾÷ ¹ýÀΰú ¹Ì±¹ ÇöÁö ¹ýÀÎÀ» ¿î¿µÇϰí ÀÖÀ¸¸ç, ´Ù¾çÇÑ ºÐ¾ßÀÇ ´É·ÂÀÖ´Â ÀÎÀçµé·Î ±¸¼ºµÈ ³»½ÇÀÖ°í ¹Ì·¡°¡ ¹àÀº ư½ÇÇÑ È¸»çÀÔ´Ï´Ù.
- ¹ÝµµÃ¼ ÄɹÌÄà ±¹³» °ø±Þ
SU-8, I-line, Ebeam, Lift-off, Polymers for NIL, Hybrid polymers, Dry film
- ÈÇÕ¹° ¹ÝµµÃ¼ ¿þÀÌÆÛ ±¹³» °ø±Þ
Epi Wafers (VcSel, LD, PD, Dector, LED),
Compound wafers (GaAs, GaSb, InP, InSb, GaN, SiC, ZnO, AlN, Etc)
- Æ÷Å丶½ºÆ® °ø±Þ
Multi-Transmission
- ¹ÝµµÃ¼ Àåºñ / tool °ø±Þ
Resistivity Measurement, Photoresist Asher, Wafer Tweezer(Vacum Wand)
- µð¹ÙÀ̽º °ø±Þ
SiC SBD, JFET, QFN Ocpp, OmPP Package
ÀÎÀç»ó
´Éµ¿Àû, »ó»ý, ¹è·Á, ¹Ì·¡ ºñÁ¯, ´Ù¾çÇÑ ¾ÆÀ̵ð¾î, ÃßÁø·Â, ²÷ÀÓ¾ø´Â ÀÚ±â°è¹ß
¿¬Çõ
1989.09 ¼±³Æ®·¹À̵ù ¼³¸³
1989.01 ¢ß¼±³»ó¿ªÀ¸·Î ¹ýÀÎ Àüȯ
1990.02 ¹ÝµµÃ¼ ÄɹÌÄà ¿µ¾÷ ½ÃÀÛ – ACT Inc (Now Airproduct)
1992.03 ÈÇÕ¹° ¹ÝµµÃ¼ ¿µ¾÷ ½ÃÀÛ
IQE UK, Inc, RF, Silicon (Epi foundary)¿Í µ¶Á¡ ´ë¸®Á¡ °è¾à
1999.01 ´ëÇ¥ÀÌ»ç º¯°æ (Á¤ÁøÇÑ ´ëÇ¥ÀÌ»ç ȸ»ç Àμö)
2000.08 PhotoResist(PR) ¿µ¾÷ ½ÃÀÛ
MicroChem Inc¿Í µ¶Á¡ ´ë¸®Á¡ °è¾à
2002.03 »óÈ£ º¯°æ ¢ßÄÉÀÌ¿ø ¼Ö·ç¼Ç(K1 solution Inc)
2003.03 PhotoMask ¿µ¾÷ ½ÃÀÛ – ¹Ì±¹ Advanced Reproduction Tech
2006.04 ³ª³ë ÀÓÇÁ¸°ÆÃ ½ºÅÆÇÁ ¿µ¾÷ ½ÃÀÛ
2007.04 ¹Ì±¹ ¿¬¶ô »ç¹«¼Ò °³¼³ (º¸½ºÅæ)
2008.01 Wafer Technology (ÈÇÕ¹° ¹ÝµµÃ¼ Àü¹® ȸ»ç)¿Í µ¶Á¡ ´ë¸®Á¡ °è¾à
2010.06 ¹Ì±¹ ÇÕÀÛȸ»ç ¼³¸³, Lehitech, Inc. (¹Ì±¹ ÇöÁö ¹ýÀÎ, LEDÁ¶¸í ¿Ü)
11 Quik-Pak (Chip packaging)°ú ´ë¸®Á¡ °è¾à
2011.09 PCB Entry sheet ¿ø·á °¡°ø ¹× °ø±Þ
2012.03 LED»ç¾÷ºÎ Ãâ¹ü µµ,¼Ò¸Å À¯Åë ¿µ¾÷