회사소개
당사는 싱가포르에 본사를 두고 있는 쿠리키 앤드 소파 의 한국 지사입니다.
1951년 미국에서 설립되었으며, 나스닥 상장사 입니다.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.
Kulicke & Soffa, incorporated in 1951 and comprising of approximately 2,200 employees worldwide, provides equipment and tools that are used in the production of a wide range of semiconductor devices. Our customers produce the "chips" that drive the information economy and enable products such as computers, smart phones, media tablets, LED TVs, and pacemakers.
Market Share Products
#1 Automatic Ball Bonders
#1 Capillaries
#1 Copper & Aluminum Wire
#1 Manual Wire Bonders
#1 Wafer-level Stud Bump Bonders
#2 IC Dicing Blades
#3 Gold Bonding Wire
연혁
K&S Timeline
1951 Fred Kulicke & Al Soffa sign partnership agreement
1961 KLIC listed on NASDAQ
1972 Micro Swiss (now K&S Bonding Tools) joins K&S
1972 First automatic wire bonder - K&S Model 1412
1981 K&S opens sales & service facility in Japan
1995 American Fine Wire (now K&S Bonding Wire) joins K&S
1996 Semitec (now K&S Dicing Wheels) joins K&S
1996 K&S & Delco establish Flip Chip Technologies
2000 K&S introduces world"s fastest, finest pitch wire bonders (8028s, 8028pps)
2000 K&S acquires Cerprobe and Probe Tech, and combines these entities to form the
K&S Test Division.
2000 K&S opens Singapore manufacturing facility
2001 K&S launches e-commerce website
2002 Groundbreaking for K&S China manufacturing facility
2003 Grand Opening of First China-Based Manufacturing Operation
2003 K&S ships one million capillaries from China
2004 K&S sells flip chip business to FlipChip International, LLC
2005 K&S launches next generation wire bonding and stud bumping machines
2006 K&S sells wafer test business to SV Probe and package test business to Investcorp
2007 K&S Acquires Alphasem, a supplier of die bonding equipment, from Dover Technologies International, Inc.
2008 K&S Launches the Power Series, a new generation of semiconductor assembly equipment.
2008 K&S completes sale of Wire Business to W.C. Heraeus GmbH
2008 K&S completes acquisition of Orthodyne Electronics Corporation, a privately held, leading supplier of heavy wire wedge bonding equipment
2010 Relocates Corporate HQ to Singapore
2012 Groundbreaking for the new Corporate HQ Building in Singapore
2014 Grand Opening of the K&S Corporate Headquarters Building
2015 Expanding advanced packaging portfolio and diversifying into the automotive and industry markets through Advanced SMT
