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1999 È÷Æ®(HITS) ¼³¸³
2000~2005 ÁÖ½Äȸ»ç HITS ¼³¸³(¹ýÀÎÀüȯ)
Wafer Inspection System °³¹ß
PCB Inspection System °³¹ß
¿ì·®±â¼ú±â¾÷ ¼±Á¤(±â¼ú½Å¿ëºÎÁõ±â±Ý)
º¥Ã³±â¾÷ ÀÎÁõ(¼¿ïÁö¹æÁß¼Ò±â¾÷û)
Edge Grinder Vision System °³¹ß
INNO-BIZ ±â¾÷(Aµî±Þ) ¼±Á¤(Áß¼Ò±â¾÷û)
LCD Ç¥¸é °Ë»çÀåÄ¡ °³¹ß
LCD Micro °Ë»çÀåÄ¡ °³¹ß
LCD Ball, Column °Ë»çÀåÄ¡ °³¹ß
ºÎ¼³¿¬±¸¼Ò ¼³¸³
BLU Film sheet Inspection System °³¹ß
OLED Aging System °³¹ß
2006~2010 PDP Grinder Inspection System °³¹ß
Multi-layer Optical Film °Ë»ç¼³ºñ °³¹ß
Polarizer Inspection System °³¹ß
Wire Bonding Inspection System °³¹ß
(IR52 À念½Ç»ó ¼ö»ó)
±â¼úº¸Áõ±â±Ý A+ Member °¡ÀÔ
LCD ÈÖÁ¡ °Ë»ç±â °³¹ß
Copper Foil Inspection System °³¹ß
Solar Cell/Wafer Auto °Ë»ç ¼³ºñ °³¹ß
LED Package ÀÚµ¿°Ë»ç ½Ã½ºÅÛ °³¹ß
2011~ÇöÀç LCD Glass Micro Crack Inspection
System °³¹ß ¹× °Ë»ç ¾Ë°í¸®Áò °³¹ß
LED ¼ÒÀÚÀÇ °Ë»ç ÀåÄ¡ °³¹ß ¹× ƯÇã Ãâ¿ø
3D Wire Loop Çü»ó ÃøÁ¤Àåºñ °³¹ß
2Â÷ ÀüÁö Ç¥¸é°áÇÔ°Ë»ç ÀåÄ¡°³¹ß
SMT Auto Loader °³¹ß
Module Inline ÀÚµ¿È ¶óÀÎ ±¸Ãà
(IR52 À念½Ç»ó ¼ö»ó)
Semiconductor Packing Automation System °³¹ß