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2013.08 MAIN-Biz ÀÎÁõ(Áß¼Ò±â¾÷û)
2013.08 Áß¼Ò±â¾÷ ÇнÀÁ¶Á÷È»ç¾÷ ¼º°ú°æÁø´ëȸ ¼ö»ó
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2012.02 µðÀÚÀÎ µî·Ï(Á¦30-0631309)
2011.12 CLEAN »ç¾÷ÀÚ ¼±Á¤
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2011.12 °øÀå ½ÅÃà ¹× º»»ç ÀÌÀü(¹é¼®°ø´Ü->¾Æ»ê½Ã À½ºÀ¸é)
2011.06 ¹ÝµµÃ¼ ºÎǰ(PIN) ½ºÅÂÃ÷ ĨÆÑ ÄÚ¸®¾Æ ³³Ç°
2010.12 ½ºÅÂÃ÷ ĨÆÑ ÄÚ¸®¾Æ Çù·Â¾÷ü µî·Ï
2010.06 ƯÇã ȹµæ(Á¦10È£-0968530È£, Á¦10-0968531È£)
2010.06 ISO K-OHSAS 18001 ÀÎÁõ ȹµæ(Çѱ¹»ý»ê¼ºº»ºÎÀÎÁõ¿ø)
2009.12 SBA Tool Cleaner ¼³ºñ Á¦ÀÛ
2009.12 MVP Off-Loader ¼³ºñ ³³Ç°
2009.09 º»»çÀÌÀü(2°ø´Ü->¹é¼®°ø´Ü)
2009.03 BIB »ç¾÷ È®´ë(»ï¼ºÀüÀÚ Áß±¹ ¼ÒÁÖ)
2009.03 ±â¾÷ºÎ¼³¿¬±¸¼Ò Àΰ¡(Çѱ¹»ê¾÷±â¼úÁøÈïÇùȸ)
2008.11 LG»êÀü(õ¾È»ç¾÷Àå) ¾÷ü µî·Ï
2008.11 INNO-Biz ÀÎÁõ(Áß¼Ò±â¾÷û)
2008.10 Wafer Back Side Coating M/C 3´ë »ï¼ºÀüÀÚ ³³Ç°
2008.08 IC Test Hander¿ë MainpulatorÁ¦ÀÛ ³³Ç°(Çϳª¸¶ÀÌÅ©·Ð)
2008.06 ISO 9000/14001 ÀÎÁõ ȹµæ(Çѱ¹»ý»ê¼ºº»ºÎÀÎÁõ¿ø)
2008.03 Burn-In Board ¼öÁÖ ¹× ¾ç»ê(»ï¼ºÀüÀÚ ¿Â¾ç)
2007.12 »ï¼ºÀüÀÚ¢ßÇù·Â¾÷ü µî·Ï
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2007.05 Wafer Back Side Coating M/C »ï¼ºÀüÀÚ ³³Ç°
2007.05 Saw Sortor Tool Kit Á¦ÀÛ ³³Ç°
2007.01 Wafer Back Side Coating M/C °³¹ßÁøÇà(»ï¼ºÀüÀÚ ¿Â¾ç)
2006.12 Box ¹°·ù Line Á¦ÀÛ ¹× ¼³Ä¡(»ï¼ºÀüÀÚ ¿Â¾ç°øÀå)
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2006.03 Edge Grinding System °³¹ß ÁøÇà
2006.01 STS¢ß¾÷üµî·Ï ¹× Auto Mold ±ÝÇü Full Set ³³Ç°
2005.12 Saw Sortor Tool Kit Á¦ÀÛ ³³Ç°(Çϳª¸¶ÀÌÅ©·Ð)
2005.11 Ball Mountor Tool Kit Á¦ÀÛ ³³Ç°(»ï¼ºÀüÀÚ ¿Â¾ç)
2005.10 LCD Cell BoxÃâÇÏ Line Á¦ÀÛ ¹× ¼³Ä¡
2005.09 Çϳª¸¶ÀÌÅ©·Ð¢ß¾÷üµî·Ï ¹× Auto Mold ±ÝÇü Full Set ³³Ç°
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