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2018. 10¿ù: ½ºÄ³³Ê On-The-Fly±â´ÉÀ» Àû¿ëÇÑ ·¹ÀÌÀú èÆÛ¸µ Àåºñ S/W °³¹ß ¹× ³³Ç°
2018. 12¿ù: ¼Ö¶ó¼¿ ·¹ÀÌÀú ÆÐÅÍ´× Àåºñ S/W °³¹ß ¹× ³³Ç°
2019. 01¿ù: ½ºÄ³³Ê On-The-Fly±â´ÉÀ» Àû¿ëÇÑ Laser Notching Àåºñ S/W °³¹ß ¹× ³³Ç°
2019. 03¿ù: Direct Image ³ë±¤ Àåºñ Autofocus S/W °³¹ß ¹× ³³Ç°
2019. 05¿ù : Wafer Laser Assist Bonding Feasibility Test Àåºñ SW °³¹ß ¹× ³³Ç°
2019. 08¿ù: 27Ãà Piezo Motor¸¦ Àû¿ëÇÑ ±¤ÇнýºÅÛ ½Ç½Ã°£ Overlay, Distortion º¸Á¤ SW °³¹ß ¹× ³³Ç°
2019. 12: Laser Wafer Dicing Feasibility Àåºñ SW °³¹ß ¹× ³³Ç°
2020. 03. ·¹ÀÌÀú 5Ãà °¡°ø µ¥¸ð Àåºñ SW °³¹ß ¹× ³³Ç°