회사소개
* 회사소개
Kulicke & Soffa는 미국 필라델피에에 본사가 있으며, 반도체 제조 장비인 Wire Bonder를 제작 판매하고 있으며, 소모품으로 bond tools, saw blade 및 wafer probe등을 공급하는 반도체 장비 회사입니다. 국내에 삼성, 하이닉스, 앰코, ASE, 시그네틱스 등 큰 반도체회사와 거래 하고 있습니다.
(총사원수 20명은 한국 지사의 인원임)
반도체 장비 제조 업체
연혁
K&S Timeline
1951 Fred Kulicke & Al Soffa sign partnership agreement
1961 KLIC listed on NASDAQ
1972 Micro Swiss (now K&S Bonding Tools) joins K&S
1972 First automatic wire bonder - K&S Model 1412
1981 K&S opens sales & service facility in Japan
1995 American Fine Wire (now K&S Bonding Wire) joins K&S
1996 Semitec (now K&S Dicing Wheels) joins K&S
1996 K&S & Delco establish Flip Chip Technologies
2000 K&S introduces world"s fastest, finest pitch wire bonders (8028s, 8028pps)
2000 K&S acquires Cerprobe and Probe Tech, and combines these entities to form the
K&S Test Division.
2000 K&S opens Singapore manufacturing facility
2001 K&S launches e-commerce website
2002 Groundbreaking for K&S China manufacturing facility
2003 Grand Opening of First China-Based Manufacturing Operation
2003 K&S ships one million capillaries from China
2004 K&S sells flip chip business to FlipChip International, LLC
2005 K&S launches next generation wire bonding and stud bumping machines
2006 K&S sells wafer test business to SV Probe and package test business to Investcorp
2007 K&S Acquires Alphasem, a supplier of die bonding equipment, from Dover Technologies International, Inc.
2008 K&S Launches the Power Series, a new generation of semiconductor assembly equipment.
2008 K&S completes sale of Wire Business to W.C. Heraeus GmbH
2008 K&S completes acquisition of Orthodyne Electronics Corporation, a privately held, leading supplier of heavy wire wedge bonding equipment
2010 Relocates Corporate HQ to Singapore
2012 Groundbreaking for the new Corporate HQ Building in Singapore
2014 Grand Opening of the K&S Corporate Headquarters Building
2015 Expanding advanced packaging portfolio and diversifying into the automotive and industry markets through Advanced SMT
