쿠리키앤드소파코리아(주) 기업정보

K&S Timeline

1951 Fred Kulicke & Al Soffa sign partnership agreement
1961 KLIC listed on NASDAQ
1972 Micro Swiss (now K&S Bonding Tools) joins K&S
1972 First automatic wire bonder - K&S Model 1412
1981 K&S opens sales & service facility in Japan
1995 American Fine Wire (now K&S Bonding Wire) joins K&S
1996 Semitec (now K&S Dicing Wheels) joins K&S
1996 K&S & Delco establish Flip Chip Technologies
2000 K&S introduces world"s fastest, finest pitch wire bonders (8028s, 8028pps)
2000 K&S acquires Cerprobe and Probe Tech, and combines these entities to form the
K&S Test Division.
2000 K&S opens Singapore manufacturing facility
2001 K&S launches e-commerce website
2002 Groundbreaking for K&S China manufacturing facility
2003 Grand Opening of First China-Based Manufacturing Operation
2003 K&S ships one million capillaries from China
2004 K&S sells flip chip business to FlipChip International, LLC
2005 K&S launches next generation wire bonding and stud bumping machines
2006 K&S sells wafer test business to SV Probe and package test business to Investcorp
2007 K&S Acquires Alphasem, a supplier of die bonding equipment, from Dover Technologies  International, Inc.
2008 K&S Launches the Power Series, a new generation of semiconductor assembly equipment.
2008 K&S completes sale of Wire Business to W.C. Heraeus GmbH 
2008 K&S completes acquisition of Orthodyne Electronics Corporation, a privately held, leading supplier of heavy wire wedge bonding equipment 
2010 Relocates Corporate HQ to Singapore
2012 Groundbreaking for the new Corporate HQ Building in Singapore 
​2014​​ ​Grand Opening of the K&S Corporate Headquarters Building
​2015 ​Expanding advanced packaging portfolio and diversifying into the automotive and industry markets through Advanced SMT