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1998. 12 D.SÁ¤°ø ¼³¸³ (for MEMS Foundry)
1999. 01 LG ÀüÀÚ ±â¼ú¿ø°ú Sapphire CMP °¡°ø±â¼ú °³¹ß
1999. 06 »ï¼ºÁ¾ÇÕ±â¼ú¿ø GyroÆÀ ¹× PrinterÆÀ°ú CMP °¡°ø±â¼ú °³¹ß
2000. 02 SOI ¹× SOG Wafer °¡°ø ±â¼ú °³¹ß ¹× ±¹³»°ø±Þ
2000. 06 Schott ¹× Coring Glass Wafer ±¹³» °ø±Þ
2001. 05 »êÇп¬ °úÁ¦ (°íºÐÀÚ ¸·À» ÀÌ¿ëÇÑ Àú¿Â Wafer Á¢ÇÕ ±â¼ú)
2002. 07 »êÇп¬ °úÁ¦ (¹Ì¼¼ À¯Ã¼ ¼ÒÀÚ¿ë Glass Wafer ÃÊÁ¤¹Ð °¡°ø ¹× Á¢ÇÕ±â¼ú°³¹ß)
2003. 06 ƯÇãÃâ¿ø(Chemical Mechanical Polishing Process¸¦ ÀÌ¿ëÇÑ Wafer  Thinning ¹æ¹ý)
2003. 07 ºÎǰ¼ÒÀç Áö¿ø»ç¾÷ (MEMS¿ë Wafer ÃÊÁ¤¹Ð °¡°ø ¹× Æò°¡ ±â¼úÁö¿ø)
2004. 06 ƯÇãÃâ¿ø (¾ç±ØÁ¢ÇÕÀ» ÀÌ¿ëÇÑ SOG ±âÆÇ Á¦Á¶¹æ¹ý)
2004. 09 KETI·Î ºÎÅÍ ±â¼úÀÌÀü (¸¶ÀÌÅ©·Î ĨÀ» ÀÌ¿ëÇÑ È¯°æºÐ¼® ¼ÒÀÚ ¼³°è ¿Ü)
2005. 03 Áß¼Ò±â¾÷±â¼úÇõ½Å°úÁ¦ ÁÖ°ü ±â¾÷ ¼±Á¤
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2007. 01 ÁÖ½Äȸ»ç µð¿¡½º¼¼¹ÌÄÜ »óÈ£ º¯°æ
2007. 02 ±â¾÷ü, ¿¬±¸¼Ò ¹× Çб³ µî¿¡ MEMS¿ë wafer ¹× Foundry Service Á¦°ø

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2024 66¾ï 5,962¸¸¿ø ¡è 125¾ï 563¸¸¿ø ¡è 2¾ï 177¸¸¿ø ¡é
2023 64¾ï 7,784¸¸¿ø 107¾ï 8,310¸¸¿ø 2¾ï 1,542¸¸¿ø

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  • ȨÆäÀÌÁö : http://www.dssemicon.com

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